Analysis

We provide two-dimensional nanoscale electrical properties measurement and imaging. Advanced electrical characterization technology and research into next generation semiconductor production equipment are our focus.

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Advanced analysis of devices including solar cells, CMOS sensor, logic/power devices and other third generation of semiconductor materials such as GaN & SiC are provided.

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Memory Device

[Summary] The internal memory can be divided into random memory RAM (RandomAccess Memory) and read-only memory ROM (Read Only Memory), and its binary operation is achieved through the on-off of the transistor. For different types of memory, the structure and connection methods of their transistors are also different. Therefore, TEM/AFM/SMM/SSRM, etc. are often used in the process to characterize the structure and carrier distribution of PMOS and NMOS regions.

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