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Scanning microwave impedance microscope (SMM)
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High sensitivity high vacuum scanning extended resistance microscope (SSRM)
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Atomic force microscope (AFM)
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Conductive atomic force microscope (CAFM)
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Scanning electron microscope (SEM-EDS)
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Transmission electron microscope (TEM-EDS)
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Focused Ion Beam (FIB)
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Scanning Capacitor Microscope (SCM)
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Reverse Engineering
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Reverse Engineering
【overview】Reverse Engineering is a technical process of reverse deriving its design principles, architectural details, manufacturing processes and even firmware algorithms by disassembling and analyzing the physical structure, electrical characteristics, and functional logic of the chip. Reverse engineering is an application of "reverse engineering" based on physical entities, which widely serves scenarios such as technical research, security verification, alternative solution development, and is also called competitive product analysis.
Chip reverse analysis is mainly divided into four steps:Disassembly and encapsulate, image acquisition, logical restoration, function verification. Among them, logic restore is the core of the reverse direction - identifying the component types and interconnection lines in the image, revealing the underlying structure, sorting out the signal flow direction, and transforming it into an easy-to-understand "logic circuit".
With the evolution of chip processes and the increase in architecture complexity, the difficulty of logic restoration has also increased exponentially, which has more stringent requirements for the accuracy and accuracy of obtaining signals. At this time, it is recommended to use new testing methods.
For reverse analysis, our company can provide a complete set of customized solutions.
